胡衡华会见惠普全球副总裁庄正松一行

Hu Henghua Meeting with Zhuang Zhengsong， Global Vice President of Hewlett-Packard （HP）

On August 24， Hu Henghua， Deputy Secretary of CPC Chongqing Municipal Committee and Mayor of Chongqing Municipal Government met with Zhuang Zhengsong， Global Vice President of HP and President of HP Greater China Region， and jointly witnessed the launch of HP’s Global Innovation Initiative—HP Advanced Technology Research and Development （R&D） Action and the signing of an agreement on the platform that integrates industry， academia and research.

Zhou Xinhong， Vice President of China HP Co.， Ltd.， Zheng Hong， Vice President of HP Greater China Region， Jiang Duntao， Vice Mayor of Chongqing Municipal Government， and Shu Lichun， Secretary of the CPC Committee of Chongqing University attended the event.

On behalf of the Chongqing Municipal Government， Hu Henghua thanked the long-term contribution made by HP and introduced Chongqing’s endeavors in promoting the implementation of national key strategies， building the “33618” System for Modern Manufacturing Clusters， fostering a Digital Chongqing， and developing electronics and IT manufacturing. He hoped that HP will maintain Chongqing as its main production base， increase orders in Chongqing， accelerate the R&D of new products， attract more supplies， and engage in coordinated innovation to advance the growth of industrial chains.

Zhuang Zhengsong noted that HP will leverage its own strength in technology and resources to optimize strategic layout， support the development of the electronics and IT manufacturing in Chongqing， and actively contribute its share to building a modern new Chongqing.

After the meeting， HP signed a strategic cooperation agreement on the platform that integrates industry， academia， and research with Chongqing University. The two sides will engage in cooperation in various areas including the building of an innovation laboratory for artificial intelligence applications， the development of new alloy materials and processes， talent cultivation， and exchanges.

Representatives from HP， Chongqing University， relevant municipal departments， and Xiyong Micro-Electronics Industrial Park attended the event.

8月24日，市委副书记、市长胡衡华会见了惠普全球副总裁兼大中华区总裁庄正松一行，并共同见证惠普全球创新行——惠普先进技术研发行动启动暨产学研平台签约活动。

中國惠普有限公司副总裁周信宏、惠普大中华区副总裁郑红，副市长江敦涛，重庆大学党委书记舒立春参加。

胡衡华代表市政府感谢惠普公司长期以来对重庆发展作出的贡献，介绍了重庆推动国家重大战略实施、打造“33618”现代制造业集群体系、推进数字重庆建设和电子信息制造产业发展情况，希望惠普公司继续把重庆作为全球主要的生产基地，将更多订单放在重庆，加快新产品研发，引入更多配套企业，开展协同创新，带动产业链发展。

庄正松表示，惠普公司将立足自身技术与资源优势，不断优化战略布局，助力重庆电子信息制造业发展，为现代化新重庆建设贡献力量。

会见活动后，惠普公司与重庆大学签订了产学研平台战略合作协议，双方将着力在人工智能应用联合创新实验室建设、新型合金材料及工艺开发、人才培养与交流等方面开展合作。

惠普公司，重庆大学，市有关部门、西永微电园负责人参加。