第12届电子封装技术和高密度封装国际会议征文通知

第12届电子封装技术和高密度封装国际会议征文通知

第十二届电子封装技术和高密度封装国际会议(ICEPT-HDP2011)将于2011年8月8日～11日在中国上海举行。会议由中国电子学会电子制造与封装技术分会(EMPT)主办，由上海大学承办。ICEPT-HDP系列会议多年来得到了IEEE-CPMT的全力支持和IMAPS、ASME和iNEMI等国际著名行业组织的积极参与。

电子封装技术和高密度封装国际会议为期4天，会议将通过专题讲座、特邀报告、主题论坛、分会报告及论文张贴等形式交流电子封装技术领域的最新进展，感受其无穷的魅力。

大会诚邀您的参与，共襄盛举！

会议主题

●先进封装与系统集成：球栅阵列封装、芯片级封装、倒装芯片；晶圆级封装、SiP；TSV、三维集成；及其它各种先进的封装和系统集成技术。

●封装材料与工艺：绿色材料、纳米材料和其它能够提高封装性能和降低成本的新型材料；以及与封装材料相关的工艺。

●封装设计与模拟：各种新的封装/组装设计；电子封装的电、热、光和机械特性建模、模拟和验证方法；多尺度和多物理量建模。

●高密度基板及组装技术：嵌入式无源和有源元件基板技术；高密度互连基板、印刷线路板、高密度高性能基板；及其它能够提高基板密度和性能的各种新型基板技术。

●封装设备及先进制造技术：封装和组装制造设备；测量方法；提高可制造性和良品率、降低成本及改善使用可靠性的新型封装/组装技术。

●质量与可靠性：质量检测与评估；快速可靠性数据采集和分析方法；可靠性模拟和寿命预测；失效分析和无损诊断等。

●固态照明封装与集成:CoB、WLP及其它各种先进的封装和集成技术；大功率LED模组的设计、制造和测试方法；LED封装及集成技术在显示器背投、微型投影仪、室内照明和街灯等方面的应用。

●新兴领域封装:传感器、执行器、微机电系统、纳机电系统、微光机电系统的封装技术；光电子封装，CMOS图像传感器封装；封装及集成技术在液晶显示，无源元件，射频、功率和高压器件，及纳米器件等新兴领域的应用。

重要日期:

●2011年4月15日论文摘要截止日期

●2011年5月22日论文接收通知日期

●2011年7月22日论文全文截止日期

论文/摘要投稿

论文内容必须为具有原创性且没有发表过的技术成果。论文摘要须用约500字的篇幅清楚地描述本工作的背景、研究方法、结果和结论，论文摘要还应包括关键的参考文献。论文摘要必须用英文、按所附电子模板的要求撰写，发送到icept2011@oa.shu. edu.cn。所有录用论文都将被收入IEEE会议论文集，优秀论文将被推荐到IEEE-CPMT的相关期刊评审发表。

优秀论文评选

会议文集将由IEEE官方收录。会议将评选优秀会议论文和优秀学生论文，并颁奖以示鼓励。

专业课程

会议将举办专业培训课程。欢迎本领域的专家用电邮icept2011@oa.shu.edu.cn与大会组委会讨论有关课程细节。

诚征参展商/赞助商

大会将为电子封装及相关工业的材料、设备、组件、软件供应商、制造商及服务商提供参展平台，有意向的参展商/赞助商请通过如下电子信箱与大会组委会联系:010-64655241 021-38953725。

大会主席：毕克允教授

大会执行主席：汪敏教授

大会组织主席：张建华教授

大会技术主席：史训清博士

大会网站：http://www.icept.org

大会电邮：icept2011@oa.shu.edu.cn

大会时间：

2011年8月8-11日（8日报到及课程培训）

会议地点/地址：

上海龙东商务酒店

上海浦东龙东大道3000号

关于上海

上海，位于中国海岸线中部的长江口，是中国的经济、金融、贸易、航运中心。目前，上海以其市场规模、制造能力和技术水平已成为中国的集成电路设计、制造和封装中心。

上海是中国主要旅游城市，具有深厚的近代城市文化底蕴和众多的历史古迹。其外滩、城隍庙和东方明珠塔都是闻名的地标。上海素有“美食天堂”、“购物乐园”之称，拥有世界各国的饮食文化、经典时尚的购物激情和浓郁的商业气息。并成功举办了2010年世界博览会。

The 12thInternational Conference on Electronic Packaging Technology&High Density Packaging(ICEPT-HDP 2011)w ill be held in Shanghai,China, from August 08 to 11,2011.The ICEPT-HDP 2011 is organized by Electronic Manufacturing and Packaging Technology Society(EMPT)of Chinese Institute of Electronics(CIE)and co-organized by Shanghai University.The conference has received strong support from IEEE CPMT and active involvement from IMPAPS,ASME and iNEMI.

ICEPT-HDP 2011 is a four-day event,featuring technical sessions,professional development courses/forums,exhibition,and social networking activities.It aims to cover the latest technological developments in electronic packaging,manufacturing and packaging equipment,and provide opportunities to explore the trends of research and development,as well as business in China.

CONFERENCE THEMES：

●Advanced Packaging&System Integration:BGA,CSP,flip chip;WLP,SiP;TSV,3D integration; and other advanced packaging and system integration technologies.

●Packaging Materials&Processes:Green materials,nano-materials and other novel materials for packaging performance enhancement and cost reduction;and various new packaging/assembly processes.

●Packaging Design and Modeling:New packaging/assembly designs;methodologies for modeling, simulation and validation of electrical,thermal,optical and mechanical performance of various electronics packages;multi-scale and multi-physics modeling.

●High Density Substrate&SMT:Substrate w ith embedded passives and active components;HDI substrate,PCB,high performance multi-layer substrate;and various novel assembly technologies that improve substrate density and performance.

●Advanced Manufacturing Technologies and Packaging Equipment:Packaging/assembly equipment;measurement techniques;novel packaging/assembly technologies for manufacturability and yield improvement,cost reduction and service performance improvement.

●Quality&Reliability:Quality monitoring and evaluation;methodologies for accelerated reliability data collection and analysis,reliability modeling and life prediction;failure analysis and non-destructive diagnose.

●Solid State Lighting Packaging&Integration:CoB,WLP and other advanced packaging/integration technologies;methodologies for design,manufacturing and testing of high power LED module; LED packaging/integration technologies and their applications in LCD,Micro-projector,in-door lighting, street lamp,etc.

●Emerging Technologies:Sensors,actuators, MEMS,NEMS and MOEMS;optoelectronics packag-ing,CMOS image sensor packaging;packaging/integration technologies and their applications in LCD,passive &RFdevices,power&HV devices,nano-devices,etc.

IMPORTANT DATES：

●April 15,2011 Deadline for Subm ission ofAbstract

●May 22,2011 Notification of Acceptance

●July 22,2011 Deadline for Subm ission of Manuscript

SUBMISSION OF Abstract：

BEST CONFERENCE PAPERS AND BEST STUDENT PAPERS

The conference proceeding is an official IEEE publication.Best Conference and Student Papers w ill be selected and awarded at the conference.

CALL FOR PROFESSIONAL DEVELOPMENT COURSES

The conference program includes professional development courses(PDC),the leading experts in the field may email icept2011@oa.shu.edu.cn for details.

CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials,equipment,components,software,manufacturers,and service providers of the electronics packaging and related industries w ill be held during the conference.Potential exhibitors and sponsors may email faith_epe@sohu.net for details.

General Chair:Prof.Keyun BI

Executive Chair:Prof.Min WANG

Organization Chair:Prof.Jianhua ZHANG

Technical Chair:Dr.Daniel SHI

Conference Website:http://www.icept.org

Conference Email:icept2011@oa.shu.edu.cn

Conference Date

August 8～11,2011

Conference Venue

Shanghai Riverfront Business Hotel

No3000,LongDong Avenue,Pudong Shanghai,China

The 12thInt'l Conference on Electronic Packaging Technology&High Density Packaging (ICEPT-HDP 2011) CALL FOR PAPERS

s are solicited to describe original and unpublished work.The

should be approx.500 words and contains a clear statement of the background,methodology,results,conclusions,and important references of the work.AllAbstracts must be in English and should be subm itted using the format provided in the attached word file to icept2011@oa.shu. edu.cn.The template forAbstractsubm ission can be downloaded at the conference website http://www.icept.org.Selected papers w ill be recommended for publication in IEEE/CPMT journals.