目录
- Research progress on solder thermal interface materials
- Review on failure analysis of interconnections in power devices
- Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test
- Interfacial enhancement of Ag and Cu particles sintering using (111)-oriented nanotwinned Cu as substrate for die-attachment
- Study on the performance of silver paste sintered sealing joints for hermetic packaging
- Drop impact analysis of TSV-based 3D packaging structure by PSO-BP and GA-BP neural networks
- Mg2Sn-induced whisker growth on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints
- Effect of surface finish metallization on interfacial bonding behavior of sintered Ag joints